High-load even pressure heatsink loading for low-profile blade computer applications
AssigneeSun Microsystems, Inc.
InventorsThomas E. Stewart, Daniel Hruska
Life of this patent
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Abstract
An apparatus for dissipating heat in a computer system includes a heat sink, at least one fastener which secures the heat sink to at least one first support member, and at least one cup. The first support member has a top side and a bottom side. The at least one cup includes a cylindrical cavity, an upper protruding lip, and a lower base having a hole through which the at least one fastener passes. A method for dissipating heat in a computer system includes, mounting a heat emitting component onto a printed circuit board, pressing a heat sink into thermal contact with a heat emitting component, inserting a cup into an aperture of the heat sink, and supporting a heat sink.
Claims19
An apparatus for dissipating heat in a computer system comprising:
- a heat sink;
- at least one fastener which secures the heat sink to at least one first support member, wherein the first support member has a top side and a bottom side;
- and
- at least one cup comprising a cylindrical cavity, an upper protruding lip, and a lower base having a hole through which the at least one fastener passes.
A method for dissipating heat in a computer system, the method comprising:
- mounting a heat emitting component onto a printed circuit board;
- pressing a first heat sink into thermal contact with a heat emitting component;
- inserting a cup into an aperture of the heat sink;
- supporting a heat sink above the printed circuit board with at least one spring-loaded screw, the printed circuit board having at least one hole.
Dependencies are inferred from the claim text.