Micro-Fluid Ejection Devices, Methods For Making Micro-Fluid Ejection Heads, and Micro-Fluid Ejection Head Having High Resistance Thin Film Heaters
AssigneeLexmark International, Inc.
InventorsYimin Guan, Stuart Jacobsen, Carl Edmond Sullivan
Life of this patent
Estimating the term…
Abstract
Micro-fluid ejection devices, methods for making micro-fluid ejection heads, and micro-fluid ejection heads, including a micro-fluid ejection head. One such micro-fluid ejection head has relatively high resistance thin film heaters adjacent to a substrate. The thin film material comprises silicon, metal, and carbon (SiMC wherein M is a metal). Each thin film heater has a sheet resistance ranging from about 100 to about 600 ohms per square and a thickness ranging from about 100 to about 800 Angstroms.
Claims15
A micro-fluid ejection head comprising relatively high resistance thin film heaters adjacent to a substrate, the thin film heaters being comprised of a thin film material comprising a silicon, metal, and carbon (SiMC, wherein M is a metal), and wherein the thin film heaters have a sheet resistance ranging from about 100 to about 600 ohms per square and the SiMC thin film material of the heaters has a thickness ranging from about 100 to about 800 Angstroms.
A method for making a micro-fluid ejection head, the process comprising:
- depositing a thin film material comprising silicon, metal, and carbon (SiMC, wherein M is a metal) adjacent to a surface of a substrate to form a thin film resistive layer, wherein the thin film resitive layer has a sheet resistance ranging from about 100 to about 600 ohms per square, a thickness ranging from about 100 to about 800 Angstroms, and a bulk resistivity ranging from about 300 to about 4000 μohm·cm;
- and
- defining anode and cathode conductors adjacent to the thin film resistive layer to provide thin film heaters.
Dependencies are inferred from the claim text.