Ink-jet recording head, method for manufacturing ink-jet recording head, and semiconductor device

An ink-jet recording head comprising:

• a substrate including a first surface, a second surface opposed to the first surface, energy-generating elements arranged above the first surface and configured to generate energy used to discharge ink;
• discharge ports through which the ink is discharged and being arranged to correspond to the energy-generating elements;
• ink channels communicatively connected to the discharge ports;
• a supply port extending from the first surface to the second surface of the substrate and communicatively connected to the ink channels;
• and
• a film extending over a wall of the supply port,
• wherein the film contains poly(p-xylylene).

An ink-jet recording head comprising:

• a substrate including a first surface, a second surface opposed to the first surface, and energy-generating elements arranged above the first surface and configured to generate energy used to discharge ink;
• and
• driving circuits arranged above the substrate and connected to the energy-generating elements, the driving circuits being configured to supply signals used to drive the energy-generating elements,
• wherein the substrate includes through-hole electrodes electrically connected to an electrode layer disposed above the first surface of the substrate and which (=through-hole electrodes) extends from the first surface to the second surface of the substrate, the through-hole electrodes and the substrate sandwich an insulating film therebetween, and the insulating film extends on the first surface of the substrate and is overlaid with a first layer extending above the first surface of the substrate.

A method for manufacturing an ink-jet recording head including:

• a substrate having a first surface, a second surface opposed to the first surface, and energy-generating elements arranged above the first surface and configured to generate energy used to discharge ink;
• discharge ports through which the ink is discharged and arranged to correspond to the energy-generating elements;
• ink channels communicatively connected to the discharge ports;
• a supply port extending from the first surface to the second surface of the substrate and communicatively connected to the ink channels;
• and
• a film extending over a wall of the supply port,
• the method comprising:
• forming a sacrificial layer on the first surface of the substrate, the sacrificial layer being selectively removable;
• forming a first layer on the sacrificial layer;
• partly exposing the sacrificial layer in such a manner that a hole is formed in the substrate and extends from the second surface of the substrate to a region of the sacrificial layer;
• partly removing the sacrificial layer;
• forming the film such that the film is in contact with the first layer disposed on the first surface of the substrate;
• and
• forming the supply port by communicatively connecting the hole to the ink channels.

A semiconductor device comprising:

• a substrate having a first surface and a second surface opposed to the first surface;
• an electronic circuit disposed above the first surface of the substrate;
• a through-hole electrode extending from the first surface to the second surface of the substrate and electrically connected to the electronic circuit;
• and
• an insulating film disposed between the through-hole electrode and the substrate,
• wherein the insulating film is partly covered with a layer disposed on the substrate.