Customized silicon chips produced using dynamically configurable polymorphic network
AssigneeUniversity of Washington
InventorsMartha Mercaldi-Kim, Mark Oskin, John Davis, Todd Austin, Mojtaba Mehrara
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AssigneeUniversity of Washington
InventorsMartha Mercaldi-Kim, Mark Oskin, John Davis, Todd Austin, Mojtaba Mehrara
Estimating the term…
A fabrication technique called “component and polymorphic network,” in which semiconductor chips are made from small prefabricated bare electronic component dies, e.g., application specific integrated circuits (ASICs), that are assembled according to designer specifications, and bonded to a semiconductor substrate comprising the polymorphic network. The component and polymorphic network assembly has a low overhead for producing custom chips. In another exemplary embodiment, the polymorphic network can be combined with functional components in a single die. The interconnect scheme for ports on the polymorphic network can be configured or reconfigured with configuration data prior to the runtime of an application, to achieve different interconnect schemes.
A customizable semiconductor chip, comprising:
A method for applying a desired interconnection scheme to a polymorphic network of a customizable semiconductor chip to provide a desired functionality for the customizable semiconductor chip, wherein the customizable semiconductor chip includes at least one functional component that is coupled to the polymorphic network in a semiconductor die, comprising the steps of:
A polymorphic network that is configured to interconnect ports and to enable redefining interconnections between the ports of one or more functional components, comprising:
Dependencies are inferred from the claim text.