Probe for high frequency signal transmission and probe card using the same

A probe card for transmitting high frequency test signals to probe electronic devices, comprising:

• a circuit board defining a top surface for electrically connecting to a test machine, and a bottom surface opposite to the top surface, the circuit board having arranged thereon a plurality of signal circuits and grounding circuits in such a manner that at least one said grounding circuit is spacedly disposed adjacent to one said signal circuit and the grounding circuits are electrically connected to grounding potential;
• a probe holder mounted on the bottom surface of the circuit board;
• and
• a plurality of signal probes and grounding probes, in which the signal probes each comprises a metal pin and at least one lead wire arranged on and electrically insulated from the metal pin and electrically connected to the grounding probes, and the metal pins of the signal probes and the grounding probes each have a probing tip for probing electronic devices, a posterior portion, and a positioning portion located between the posterior portion and the probing tip and mounted to the probe holder;
• the posterior portions of the metal pins of the signal probes being electrically connected to the signal circuits;
• the posterior portions of the grounding probes being electrically connected to the grounding circuits.

A probe card for transmitting high frequency test signals to probe electronic devices, comprising:

• a circuit board defining a top surface for electrically connecting to a test machine and a bottom surface opposite to the top surface, the circuit board having arranged thereon a plurality of signal circuits and grounding circuits in such a manner that at least one said grounding circuit is spacedly disposed adjacent to one said signal circuit, the grounding circuits are electrically connected to grounding potential, and the signal circuits each have a forcing wire for transmitting a test signal from a test machine to a test sample and a sensing wire for transmitting a correspondingly resultant sense signal from the test sample to the test machine;
• a probe holder mounted on the bottom surface of the circuit board;
• and
• a plurality of signal probes and grounding probes, in which the signal probes each comprise a metal pin and at least one lead wire arranged on the metal pin, the grounding probes are arranged in such a manner that at least one grounding probe is spacedly respectively disposed adjacent to each of the signal probes, the metal pins of the signal probes and the grounding probes each have a probing tip for probing electronic devices, a posterior portion, and a positioning portion located between the posterior portion and the probing tip and mounted to the probe holder;
• the at least one lead wire of each of the signal probes having two opposite ends respectively electrically connected to the probing tip of the associated metal pin and the sensing wire of one of the signal circuits, which the associated forcing wire being electrically connected to the posterior portion of the respective metal pin;
• the posterior portions of the grounding probes being electrically connected to the grounding circuits.