Probe card for test of semiconductor chips and method for test of semiconductor chips using the same

A method for testing semiconductor chips using a probe card, the method comprising:

• receiving, from a test head of a tester configured for EDS testing the semiconductor chips on a wafer, a signal for determining a number and a position of probe blocks to be activated, by a switching matrix of the probe card having a plurality of probe blocks;
• selecting, by the switching matrix, a set of probe blocks from the plurality of probe blocks based on the number and the position indicated in the signal from the test head;
• and
• performing the EDS test on a plurality of semiconductor chips at positions corresponding to the selected set of probe blocks in a one-step process using the selected set of probe blocks.

A probe card configured for testing semiconductor chips, the probe card comprising:

• a circuit board including a plurality of contact pads configured to receive an electrical signal for testing electrical characteristics of the semiconductor chips;
• a fixing plate configured to secure the circuit board, the fixing plate including a plurality of probe blocks, each probe block comprising a probe needle configured to apply the electrical signal to a probe pad of a corresponding one of the semiconductor chips when said probe block is selected;
• and
• a switching matrix configured to select a set of probe blocks from the plurality of probe blocks based on a number and a position within the plurality of probe blocks embodied in a probe block selection signal received from a test head of a tester configured to EDS test the semiconductor chips.