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US 2008/0164620 A1Published application
Multi-chip package and method of fabricating the same
AssigneeVIA Technologies, Inc.
InventorsYu-Yu Lin, Tsrong-Yi Wen
Life of this patent
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Abstract
A multi-chip package including a carrier, at least one first chip, and a second chip is provided. The first chip is electrically connected to the carrier and disposed on the carrier. The second chip is electrically connected to the first chip and the carrier. A part of the second chip is disposed on the first chip and another part of the second chip is disposed on the carrier. A method of fabricating the multi-chip package is also provided.
Claims20
A multi-chip package, comprising:
- a carrier;
- at least one first chip, electrically connected to the carrier, wherein the first chip is disposed on the carrier;
- and
- a second chip, electrically connected to the first chip and the carrier, wherein a part of the second chip is disposed on the first chip and another part of the second chip is disposed on the carrier.
1 more element
A method of fabricating a multi-chip package, comprising:
- providing a carrier;
- disposing at least one first chip on the carrier;
- electrically connecting the first chip and the carrier;
- disposing a part of a second chip on the first chip, and disposing another part of the second chip on the carrier;
- electrically connecting the second chip and the first chip;
- and
- electrically connecting the second chip and the carrier.
4 more elements
Dependencies are inferred from the claim text.