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US 2008/0164611 A1Published application
Method for making an integrated circuit having a via hole
AssigneeQimonda AG
InventorsHarry Hedler, Franz Kreupl, Roland Irsigler
Life of this patent
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Abstract
An integrated circuit and a method for making an integrated circuit is disclosed. In one embodiment, at least one contact of an electrically conductive material is formed on a substrate. A layer is disposed on the substrate to a predetermined height of the contact. An electrically conductive via hole is provided in the layer by the contact.
Claims53
A method making an integrated circuit comprising:
- forming at least one contact on a substrate from electrically conductive material;
- and
- disposing a layer on the substrate up to a predetermined level of the contact, including providing an electrically conductive via hole in the layer by the contact, the via hole being guided from one side of the layer to an opposite side.
An integrated circuit device comprising:
- a substrate having a contact consisting of a carbon fiber bundle, the bundle being embedded in a layer as a via hole.
An integrated circuit comprising:
- a substrate;
- at least one contact formed on the substrate from electrically conductive material;
- a layer disposed on the substrate up to a predetermined level of the contact, including an electrically conductive via hole in the layer by the contact, the via hole being guided from one side of the layer to an opposite side.
Dependencies are inferred from the claim text.