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US 2008/0164609 A1Published application
Injection molded solder ball method
AssigneeInternational Business Machines Corporation
InventorsPeter A. Gruber, Barry A. Hochlowski, David T. Naugle
Life of this patent
Estimating the term…
Abstract
Methods for making solder balls, which can be used to bump semiconductor wafers are disclosed. Methods for bumping semiconductor wafers with the solder balls are also disclosed. The solder balls can be made using an injection molded soldering (IMS) process.
Claims20
A method for making a solder ball comprising:
- providing a mold comprising at least one cavity;
- filling said at least one cavity with a molten solder;
- cooling the molten solder;
- and
- reflowing the solder to form at least one solder ball.
2 more elements
A method for forming a solder bump on a semiconductor wafer comprising:
- providing a mold comprising at least one cavity;
- filling said at least one cavity with a molten solder;
- cooling the molten solder;
- reflowing the solder to form at least one solder ball;
- aligning the at least one cavity with at least one receiving pad;
- heating to cause the at least one solder ball to flow from the at least one cavity to the at least one receiving pad in order to form at least one solder bump;
- and
- removing the mold.
5 more elements
A solder ball made by a method comprising:
- providing a mold comprising at least one cavity;
- filling said at least one cavity with a molten solder;
- cooling the molten solder;
- and
- reflowing the solder to form at least one solder ball.
2 more elements
A semiconductor wafer comprising a solder bump made by a method comprising:
- providing a mold comprising at least one cavity;
- filling said at least one cavity with a molten solder;
- cooling the molten solder;
- reflowing the solder to form at least one solder ball;
- aligning the at least one cavity with at least one receiving pad;
- heating to cause the at least one solder ball to flow from the at least one cavity to the at least one receiving pad in order to form at least one solder bump;
- and
- removing the mold.
5 more elements
Dependencies are inferred from the claim text.