Electric power converter and mounting structure of semiconductor device
AssigneeDenso Corporation
InventorsDaisuke Harada, Hiroshi Ishiyama
Life of this patent
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Abstract
An electric power converter has a main circuit section including a semiconductor module and a cooling device; a control circuit substrate section electrically connected to a signal terminal of the semiconductor module, and having a control circuit; and a power wiring section connected to a main electrode terminal of the semiconductor module. The main circuit section is interposed between the control circuit substrate section and the power wiring section.
Claims11
A mounting structure of a semiconductor device, the structure comprising:
- a semiconductor module including a semiconductor element for supplying electricity, a first and a second electrode plates disposed on both sides of the semiconductor element, a connecting terminal connected to a control circuit for controlling the semiconductor element, and a resin mold having electric insulation for sealing the semiconductor element and the first and the second electrode plates;
- and
- a first and a second holding members having electric conductivity for holding the semiconductor module from both sides of the semiconductor module through a first and a second insulation members as a dielectric member, wherein
- the first or second electrode plate, the first or second holding member, the first or second insulation member provide a bypass capacitor for reducing noise.
A mounting structure of a semiconductor device, the structure comprising:
- a semiconductor module including a semiconductor element for supplying electricity, a first and a second electrode plates disposed on both sides of the semiconductor element, a connecting terminal connected to a control circuit for controlling the semiconductor element, and a resin mold having electric insulation for sealing the semiconductor element and the first and the second electrode plates;
- and
- a first and a second holding members as a dielectric member having electric insulation for holding the semiconductor module from both sides of the semiconductor module and including a first and a second electrically conductive inner members inserted into the first and the second holding members, respectively, wherein
- the first or second electrode plate, the first or second inner member, wall portion of the first or second holding member provide a bypass capacitor for reducing noise.
A mounting structure of a semiconductor device, the structure comprising:
- a semiconductor module including a semiconductor element for supplying electricity, a first and a second electrode plates disposed on both sides of the semiconductor element, a connecting terminal connected to a control circuit for controlling the semiconductor element, and a resin mold having electric insulation for sealing the semiconductor element and the first and the second electrode plates;
- and
- a metallic casing accommodating cooling medium having electric conductivity, wherein a plurality of the semiconductor modules is proximally disposed in the cooling medium of the casing, wherein
- the first or second electrode plate, the cooling medium, a first or second mold portion of the resin mold provide a bypass capacitor for reducing noise.
Dependencies are inferred from the claim text.