Heat dissipating semiconductor package

Abstract

A heat dissipating semiconductor package is disclosed, including a chip carrier; at least a semiconductor chip mounted and electrically connected to the chip carrier; and a heat dissipating member mounted on the semiconductor chip with a thermal interface material (TIM) interposed therebetween, wherein the TIM is provided with a plurality of fillers for supporting the TIM at an appropriate height, thereby preventing the TIM from being wetted so as to avoid collapsing and overflow of the TIM as a result of wetting problem.

Dependencies are inferred from the claim text.