Ball grid array structures having tape-based circuitry
AssigneeMicron Technology, Inc.
InventorMichael W. Morrison
Life of this patent
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Abstract
Semiconductor device packages formed in accordance with methods of packaging semiconductor dice in grid array-type semiconductor device packages using conventional lead frame or lead lock tape assembly equipment are disclosed. Circuitry-bearing structure having an electrically insulating layer that carries redistribution electrical connections having redistributed bond pads and conductive traces and which is supported from beneath by a support layer are configured for securing to the active surface of a semiconductor die. The support layer may comprise an electrically conductive material, which may act as a heat sink or as a ground plane for the packaged semiconductor device A semiconductor device and a semiconductor assembly are also provided.
Claims25
A circuitry-bearing structure for use in forming a semiconductor device assembly including redistributed electrical connections comprising:
- a tape comprising an electrically insulating material and carrying a portion of the redistributed electrical connections, the portion of the redistributed electrical connections consisting of redistributed bond pads and conductive traces;
- and
- an at least semi-rigid support layer secured adjacent to a surface of the tape opposite from the redistribution connections.
A circuitry-bearing structure for use in forming a semiconductor device assembly including redistributed electrical connections, comprising:
- a tape consisting of an electrically insulating material and a portion of the redistributed electrical connections carried by the electrically insulating material, the portion of the redistributed electrical connections comprising redistributed bond pads and conductive traces;
- and
- an at least semi-rigid support layer secured adjacent to a surface of the tape opposite from the redistribution connections.
A semiconductor device, comprising:
- a semiconductor die having an active surface including a central region having bond pads thereupon;
- a first segment comprising support structure and having a surface with a first circuit portion thereon and another, opposing surface secured over a portion of the active surface adjacent the central region;
- a second segment discrete from the first segment comprising a support structure and having a surface with a second circuit portion thereon and a another, opposing surface secured over another portion of the active surface adjacent the central region opposite the first segment;
- and
- intermediate conductive elements electrically connecting bond pads in the central region of the active surface to corresponding conductive traces on respective surfaces of the first and second segments.
A semiconductor device assembly including redistributed electrical connections, comprising:
- a semiconductor die having an active surface including a central region having bond pads thereon;
- a first adhesive layer positioned on a portion of the active surface of the semiconductor die adjacent the central region;
- a first segment secured to the first adhesive layer and comprising a portion of the redistributed electrical connections comprising redistributed bond pads and conductive traces;
- and
- intermediate conductive elements electrically connecting bond pads to corresponding conductive traces on the first segment.
Dependencies are inferred from the claim text.