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US 2008/0164599 A1Published application
Semiconductor module
AssigneeInfineon Technologies AG
InventorsMarkus Brunnbauer, Joachim Mahler, Manfred Mengel
Life of this patent
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Abstract
A module (100) is described having a semiconductor chip (1) which has at least one contact pad (2). A first dielectric layer (3), which contains a fluorocarbon compound, as well as a first wiring layer (4) are applied to the semiconductor chip (1).
Claims40
A semiconductor module comprising:
- a semiconductor chip comprising at least one contact pad;
- a first dielectric layer which is applied to the semiconductor chip and comprises a fluorocarbon compound;
- and
- a first wiring layer, which is applied to the semiconductor chip.
1 more element
A semiconductor module comprising:
- a semiconductor chip comprising at least one contact pad;
- a first dielectric layer which is applied to the semiconductor chip and has a dielectric constant of approximately less than 3.2;
- and
- a first wiring layer which is applied to the semiconductor chip.
1 more element
A method of manufacture of a semiconductor module comprising:
- producing a semiconductor chip with at least one contact pad;
- applying a first dielectric layer comprising a fluorocarbon compound to the semiconductor chip;
- and
- applying a first wiring layer to the semiconductor chip.
1 more element
A method of manufacture of a semiconductor module comprising:
- producing an encapsulation element with at least two semiconductor chips;
- applying a first dielectric layer comprising a fluorocarbon compound to the encapsulation element;
- and
- applying a first wiring layer to the first dielectric layer.
1 more element
Dependencies are inferred from the claim text.