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US 2008/0164594 A1Published application
Cap package for micro electro-mechanical system
AssigneeLingsen Precision Industries, Ltd.
InventorsJiung-Yue TIEN, Ming-Te Tu, Chin-Ching Huang
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Abstract
A cap package for MEMS includes a substrate having a connection zone that is grounded, a chip mounted on the substrate, a cap capped on the substrate and provided with a through hole corresponding to the chip, and a conducting glue made of a non-metal material having a resistivity smaller than 102 Ωm. The conducting glue is applied on the connection zone of the substrate and sandwiched between the cap and the substrate for electrically connecting the cap with the substrate.
Claims4
A cap package for micro electro-mechanical system, comprising:
- a substrate having a connection zone that is grounded;
- a chip mounted on the substrate;
- a cap capped on the substrate and provided with a through hole corresponding to the chip;
- and
- a conducting glue made of a non-metal material having a resistivity smaller than 102 Ωm, the conducting glue being applied on the connection zone of the substrate and sandwiched between the cap and the substrate.
2 more elements
Dependencies are inferred from the claim text.