Microelectronic component assemblies with recessed wire bonds and methods of making same

A microelectronic component assembly comprising:

• a microelectronic component having an active surface that carries a first terminal and a second terminal;
• a substrate attached to the active surface of the microelectronic component, the substrate having a body, a reduced-thickness base portion, and a passage through the base portion that is disposed adjacent the terminals of the microelectronic component, the body having an outer surface at a first height outwardly from the active surface of the microelectronic component and the base portion having a bond surface at a second height outwardly from the active surface of the first microelectronic component, the first height being greater than the second height;
• a first bond wire electrically coupling the first terminal to a first bond pad carried by the bond surface and a second bond wire electrically coupling the second terminal to a second bond pad carried by the bond surface, each of the first and second bond wires having a maximum height outwardly from the active surface of the microelectronic component that is no greater than the first height;
• and
• a conductive structure coupled to a contact carried by the contact surface.

A method of manufacturing a microelectronic component assembly, comprising:

• juxtaposing a back surface of a substrate with an active surface of a microelectronic component, wherein the substrate has a body, a reduced-thickness base portion, and a passage through the base, the body having a first thickness and the base portion having a second thickness that is less than the first thickness, and the active surface of the microelectronic component carries an array of terminals that is accessible through the passage;
• attaching the back surface of the substrate to the active surface of the microelectronic component with the body of the substrate having a contact surface that is spaced a body height outwardly from the active surface of the microelectronic component;
• attaching a first bond wire to a first terminal of the array and to a first bond pad carried by the base portion of the substrate, the first bond wire having a maximum height outwardly from the active surface that is less than the body height;
• and
• attaching a second bond wire to a second terminal of the array and to a second bond pad carried by the base portion of the substrate, the second bond wire having a maximum height outwardly from the active surface that is less than the body height.