Semiconductor power device
AssigneeDiodes Incorporated
InventorsTan Xiaochun, Li Yunfang
Life of this patent
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Abstract
In one embodiment the present invention includes a semiconductor power device. The semiconductor power device includes a single gauge lead frame, a semiconductor die, and a heat sink. The semiconductor die is attached to a first level of the lead frame. The heat sink is attached to a second level of the lead frame. A molding compound encapsulates the semiconductor die and a portion of the lead frame, such that a portion of the heat sink is outside of the molding compound. The resulting device may be efficiently manufactured as compared to dual gauge lead frame devices or devices where the semiconductor die is not attached to the lead frame.
Claims24
A packaged power semiconductor device, comprising:
- a single gauge lead frame;
- a semiconductor die attached to said single gauge lead frame;
- a heat sink attached to said single gauge lead frame;
- and
- a molding compound that encapsulates said semiconductor die and a portion of said single gauge lead frame, such that a portion of said heat sink is outside of said molding compound.
A method of making a packaged power semiconductor device, comprising the steps of:
- providing a single gauge lead frame;
- attaching a semiconductor die to said single gauge lead frame;
- attaching a heat sink to said single gauge lead frame;
- encapsulating said semiconductor die and a portion of said single gauge lead frame with a molding compound such that a portion of said heat sink is outside of said molding compound.
A packaged power semiconductor device, comprising:
- a two-level single gauge lead frame;
- a semiconductor die attached to a first level of said two-level single gauge lead frame;
- a heat sink attached to a second level of said two-level single gauge lead frame;
- and
- a molding compound that encapsulates said semiconductor die and a portion of said two-level single gauge lead frame, such that a portion of said heat sink is outside of said molding compound.
Dependencies are inferred from the claim text.