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US 2008/0164583 A1Published application
Chip package capable of minimizing electro-magnetic interference
AssigneeLingsen Precision Industries, Ltd.
InventorsJiung-Yue Tien, Ming-Te Tu, Chin-Ching Huang
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Abstract
A cap package includes a substrate on which a chip is mounted. A cap is made of silicon doped with non-metal dopant. The cap is capped on the substrate to define with the substrate an accommodation chamber that receives the chip inside. The chip is electrically connected with a conducting portion of the substrate which is grounded.
Claims9
A cap package comprising:
- a substrate;
- a cap made of silicon doped with non-metal dopant and capped on the substrate to define with the substrate an accommodation chamber;
- and
- a chip mounted on the substrate and located inside the accommodation chamber.
1 more element
Dependencies are inferred from the claim text.