Method for manufacturing a three-dimensional semiconductor device and a wafer used therein
AssigneeElpida Memory, Inc.
InventorsHiroaki Ikeda, Masakazu Ishino, Hiroyuki Tenmei, Naoya Kanda, Yasuhiro Naka, Kunihiko Nishi
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Abstract
A method for manufacturing a semiconductor device includes the steps of forming first and second semiconductor wafers each including an array of chips and elongate electrodes, forming a groove on scribe lines separating the chips from one another; coating a surface of one of the semiconductor wafers with adhesive; bonding together the semiconductor wafers while allowing the groove to receive therein excessive adhesive; and heating the wafers to connect the elongate electrodes of both the semiconductor wafers.
Claims7
A method for manufacturing a semiconductor device comprising:
- forming first and second semiconductor wafers each including therein a plurality of chips and an elongate electrode, said chips being separated from one another by a scribe line;
- forming a groove on a surface of at least one of said semiconductor wafers along said scribe line;
- coating said surface of said at least one of said semiconductor wafers or a surface of the other of said semiconductor wafers with first adhesive;
- bonding together said first and second semiconductor wafers by using said first adhesive while allowing said groove to receive therein excessive adhesive;
- and
- connecting together said elongate electrodes of said first and second semiconductor wafers.
A semiconductor wafer comprising:
- a plurality of chips formed on a surface of said semiconductor wafer;
- a plurality scribe lines formed on said surface to separate said chips from one another;
- and
- a groove formed on at least one of said scribe lines.
Dependencies are inferred from the claim text.