Integrated circuits with conductive features in through holes passing through other conductive features and through a semiconductor substrate

An integrated circuit comprising:

• a semiconductor substrate;
• one or more first conductive features overlying the semiconductor substrate;
• one or more through-holes passing through the one or more first conductive features and the semiconductor substrate, wherein each first conductive feature has an edge at a sidewall of one of said one or more through-holes;
• one or more second conductive features, each second conductive feature at least partially located in one of said through-holes and contacting a first conductive feature having an edge at the sidewall of said one of said one or more through-holes, each second conductive feature providing an electrical contact for contacting the integrated circuit at a bottom of the integrated circuit.