Substrate with embedded passive element and methods for manufacturing the same

A substrate with an embedded passive element, comprising:

• an interlayer circuit board, having a first conductive circuit formed thereon;
• a dielectric layer, disposed on the interlayer circuit board, and having a first recess and a second recess;
• a first electrode, disposed in the first recess of the dielectric layer;
• a second electrode, disposed in the second recess of the dielectric layer, whereby the embedded passive element is formed by the first electrode, the second electrode, and the dielectric layer between the first electrode and the second electrode;
• and
• a second conductive circuit disposed on the first electrode and the second electrode.

A method for manufacturing a substrate with an embedded passive element, comprising:

• providing an interlayer circuit board, having a first conductive circuit formed thereon;
• providing a metal sheet having a dielectric layer disposed on its surface;
• laminating the metal sheet onto the interlayer circuit board, whereby the dielectric layer contacts the first conductive circuit on the interlayer circuit board;
• forming a first recess and a second recess in the metal sheet and the dielectric layer;
• filling the conductive material in the first recess and the second recess to form a first electrode and a second electrode, whereby the embedded passive element is formed by the first electrode, the second electrode, and the dielectric layer between the first electrode and the second electrode;
• and
• forming a second conductive circuit on the first electrode and the second electrode.