Semiconductor device and method of forming the same
AssigneeSamsung Electronics Co., Ltd.
InventorsHan-Su Kim, Jin-Sung Lim
Life of this patent
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Abstract
There are provided a semiconductor device and a method of forming the same. The semiconductor device may include a semiconductor substrate including a digital circuit region and an analog circuit region, a device isolation layer on the boundary between the digital circuit region and the analog circuit region, a conductive region adjacent to the side surface and the bottom surface of the isolation layer, and a ground pad which is electrically connected to the conductive region and to which a ground voltage is applied.
Claims17
A semiconductor device comprising:
- a semiconductor substrate including a digital circuit region and an analog circuit region;
- a device isolation layer on the boundary between the digital circuit region and the analog circuit region;
- a conductive region adjacent to a side surface and a bottom surface of the device isolation layer;
- and
- a ground pad electrically connected to the conductive region and to which a ground voltage is applied.
A method of manufacturing a semiconductor device comprising:
- preparing a semiconductor substrate including a digital circuit region and an analog circuit region;
- forming a mask pattern on the semiconductor substrate;
- performing an etching process in the semiconductor substrate using the mask pattern as a mask to form a trench on the boundary between the digital circuit region and the analog circuit region;
- forming a conductive region on a side surface and a bottom surface of the trench;
- forming an device isolation layer to fill the trench;
- and
- forming a ground pad on the semiconductor substrate to be electrically connected to the conductive region.
Dependencies are inferred from the claim text.