Electronic assembly for image sensor device and fabrication method thereof

An electronic assembly for an image sensor device, comprising:

• a package module, comprising:
• a lower substrate and an upper substrate opposite thereto;
• a device chip disposed between the lower and upper substrates;
• a first conductive layer over a first sidewall of the lower substrate, insulated from the device chip;
• a first protective layer on the first conductive layer, exposing a portion of the first conductive layer over the first sidewall of the lower substrate;
• and
• a first pad on the bottom surface of the lower substrate, electrically connected to the first conductive layer;
• a lens set mounted on the package module;
• and
• an opaque conductive layer disposed on the sidewall of the lens set and electrically connected to the first conductive layer.

A method for fabricating an electronic assembly for an image sensor device, comprising:

• providing a package module, comprising:
• a lower substrate and an upper substrate opposite thereto;
• a device chip disposed between the lower and upper substrates;
• a first conductive layer over a first sidewall of the lower substrate, insulated from the device chip;
• a first protective layer on the first conductive layer;
• and
• a first pad on the bottom surface of the lower substrate, electrically connected to the first conductive layer;
• partially removing the first protective layer to expose a portion of the first conductive layer over the first sidewall of the lower substrate;
• mounting a lens set onto the package module;
• forming an opaque conductive layer on the sidewall of the lens set and directly on the exposed portion of the first conductive layer;
• and
• mounting the package module with the lens set on a printed circuit board comprising a grounding pad therein.