Semiconductor device and method for making the same
AssigneeKabushiki Kaisha Toshiba
InventorsTsuyoshi OHTA, Takahiro Kawano
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AssigneeKabushiki Kaisha Toshiba
InventorsTsuyoshi OHTA, Takahiro Kawano
Estimating the term…
A semiconductor device according to the present invention includes: a first trench that is formed in a semiconductor substrate; a gate oxide film that is formed on a surface of the first trench; and a trench gate electrode that is formed so as to bury the first trench via the gate oxide film. The semiconductor device also includes: a second trench that is formed in the semiconductor substrate with a width wider than the width of the first trench; and a terminal-embedded insulation layer that is formed so as to bury the second trench. The semiconductor device further includes: a third trench that is formed in the semiconductor substrate with a width wider than the width of the second trench; and a trench contact electrode that is formed so as to bury the third trench.
A semiconductor device comprising:
A method for making a semiconductor device comprising:
A method for making the semiconductor device comprising:
Dependencies are inferred from the claim text.