Semiconductor Device and Manufacturing Method Thereof, and Liquid Crystal Display Device
AssigneeSharp Kabushiki Kaisha
InventorsKazuhide Tomiyasu, Yutaka Takafuji, Masao Moriguchi
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Abstract
An active matrix substrate includes a glass substrate, a driver portion formed on the glass substrate in a protruding state, a stepped portion formed along a surface of the driver portion and a surface of the glass substrate, an insulating reentrant-angle compensating film formed on a surface of the stepped portion, for compensating for at least a part of a reentrant-angle shape of the stepped portion, and a wiring layer formed along a surface of the reentrant-angle compensating film and connected to the driver portion.
Claims9
A semiconductor device, comprising:
- a substrate;
- a semiconductor device portion formed on the substrate in a protruding state and having a semiconductor element;
- a stepped portion formed along a surface of the semiconductor device portion and a surface of the substrate;
- an insulating reentrant-angle compensating film formed on a surface of the stepped portion, for compensating for at least a part of a reentrant-angle shape of the stepped portion;
- and
- a wiring layer formed along a surface of the reentrant-angle compensating film and connected to the semiconductor device portion.
A method for manufacturing a semiconductor device, comprising the steps of:
- forming a semiconductor device portion having a semiconductor element, on a substrate in a protruding state;
- forming an insulating reentrant-angle compensating film on a stepped portion formed along a surface of the semiconductor device portion and a surface of the substrate, for compensating for at least a part of a reentrant-angle shape of the stepped portion;
- and
- forming, along a surface of the reentrant-angle compensating film, a wiring layer that is connected to the semiconductor device portion.
A liquid crystal display device comprising:
- an active matrix substrate having a plurality of pixels arranged in a matrix;
- a counter substrate facing the active matrix substrate;
- and a liquid crystal layer formed between the active matrix substrate and the counter substrate, wherein
- the active matrix substrate includes a transparent substrate, a semiconductor device portion formed on the substrate in a protruding state and having a semiconductor element, a stepped portion formed along a surface of the semiconductor device portion and a surface of the substrate, an insulating reentrant-angle compensating film formed on a surface of the stepped portion, for compensating for at least a part of a reentrant-angle shape of the stepped portion, and a wiring layer formed along a surface of the reentrant-angle compensating film and connected to the semiconductor device portion.
Dependencies are inferred from the claim text.