US 2008/0164147 A1 · Film Forming Apparatus

Abstract

There is provided a film forming apparatus which is capable of forming a film on both surfaces of a substrate by sputtering continuously with high efficiency by restraining a rise in temperature of the substrate to a predetermined value or higher. In a film forming chamber 2 the pressure of which is controlled, while a rotating drum 7 is rotated by the driving of a drive motor 8, a film is formed on the top surface of a substrate 12 on a substrate tray 13 held on a substrate holder 10 by cathodes 17a and 17b for outer surface to which a d.c. voltage or an a.c. voltage or a high-frequency voltage is applied, and also a film is formed on the back surface of the substrate 12 on the substrate tray 13 held on the substrate holder 10 by cathodes 14a and 14b for inner surface to which a d.c. voltage or an a.c. voltage or a high-frequency voltage is applied, by which a high-quality film is formed on both surfaces of the substrate 12 by sputtering continuously with high efficiency by restraining a rise in temperature of the substrate to a predetermined value or higher.

Claims29

Dependent claims

A film forming apparatus comprising:

a circular or polygonal cylindrical rotating body which is rotatably provided in a film forming chamber the pressure of which can be controlled;
a rotating body driving means for rotationally driving the cylindrical rotating body;
a first sputter film forming means provided so as to face the outer surface side of the cylindrical rotating body;
a second sputter film forming means provided so as to face the inner surface side of the cylindrical rotating body;
a substrate tray on which a substrate is placed so that the edge portions of the substrate are held and the top surface and the back surface of the substrate are exposed;
and
a substrate holder which is provided in an opening formed in the peripheral surface of the cylindrical rotating body to detachably hold the substrate tray so that the top surface and the back surface of the substrate are exposed,
wherein a film is formed on the top surface of the substrate on the substrate tray held on the substrate holder by using the first sputter film forming means, and a film is formed on the back surface of the substrate on the substrate tray held on the substrate holder by using the second sputter film forming means, in the film forming chamber the pressure of which is controlled, while the cylindrical rotating body is rotated by the driving of the rotating body driving means.

5 more elements

Dependencies are inferred from the claim text.

Film Forming Apparatus

Life of this patent

Film Forming Apparatus

Life of this patent

Abstract

Claims29