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US 2008/0164058 A1Published application
Multi-layer printed wiring board
AssigneeElpida Memory, Inc.
InventorsShunichi Saito, Toshio Sugano, Atsushi Hiraishi
Life of this patent
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Abstract
A multi-layer printed circuit board for mounting memories, includes: laminated wiring layers on which wiring are arranged; and a plurality of interlayer connection components which electrically connect at least two of the wiring layers. At least one of the plurality of interlayer connection components is a blind via-hole.
Claims15
A multi-layer printed circuit board for mounting memories, comprising:
- laminated wiring layers on which wiring are arranged;
- and
- a plurality of interlayer connection components which electrically connect at least two of said wiring layers,
- wherein at least one of said plurality of interlayer connection components is a blind via-hole.
1 more element
Dependencies are inferred from the claim text.