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US 2008/0164057 A1Published application
Printed Wiring Board And Method Of Manufacturing Same
OwnerHiroyuki Mori, Kimihiro Yamanaka +1inventors
InventorsHiroyuki Mori, Kimihiro Yamanaka, Yasushi Kodama
Life of this patent
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Abstract
A printed wiring board has a via land, a glass epoxy resin layer, a via conductor, and a block layer. The via land is formed on a core layer. The glass epoxy resin layer is formed on the core layer and the via land. The via conductor is formed on the via land. The block layer is formed on the via land, between the via conductor and the glass epoxy resin layer.
Claims6
A printed wiring board comprising:
- a base substrate;
- a land conductor layer provided on said base substrate at least in part thereof;
- an insulating layer provided on said base substrate and said land conductor layer, said insulating layer having a via hole reaching said land conductor layer, and containing glass fibers;
- a via conductor layer covering a surface of said via hole and a surface of said insulating layer at least in the vicinity of an opening of said via hole, said via conductor layer being connected to said land conductor layer;
- and
- a block layer provided between the surface of said via hole and said via conductor layer for preventing migration to said via conductor layer through the glass fibers inside said insulating layer, said block layer covering the inner wall of said insulating layer at least over a range from the uppermost end to the lowermost end where said glass fibers inside said insulating layer exist, and the lower end of said block layer is located above the surface of said land conducting layer.
3 more elements
A method of manufacturing a printed wiring board, comprising the steps of:
- (a) providing a base substrate;
- (b) providing a land conductor layer on said base substrate at least in part thereof;
- (c) providing an insulating layer containing glass fibers so as to cover said base substrate and said land conductor layer;
- (d) providing a first via hole in said insulating layer over said land conductor layer;
- (e) providing a second via hole in said first via hole, said second via hole reaching said land conductor layer, and block layer on a surface of said first via hole for preventing migration through the glass fibers inside said insulating layer;
- and
- (f) providing a via conductor layer covering a surface of said second via hole, said block layer, insulating layer at least in the vicinity of an opening of said first via hole and connected to said land conductor layer, step (e) of providing said second via hole and said block layer including the steps of:
- filling said first via hole with an insulating material;
- and
- removing the columnar portion from the surface of said insulating material to the surface of said land conductor layer of said filled insulating material and said insulating layer between the base of said first via hole and the surface of said land conductor layer, so as to leave the insulating material of given width on the surface of said first via hole.
7 more elements
Dependencies are inferred from the claim text.