Method for fabricating microneedle array and method for fabricating embossing mold of microneedle array
AssigneeNational Chiao Tung University
InventorsJin-Chern CHIOU, Chen-Chun HUNG, Chih-Wei CHANG
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Abstract
The present invention discloses a method for fast fabricating microneedle arrays with an embossing process and a method for fabricating an embossing mold of a microneedle array, wherein a master pattern of a high aspect ratio silicon microneedle array is fabricated with a microelectromechanical technology, and the master pattern is used to fabricate an embossing mold; a thermosetting material is filled into the embossing mold; then, baking, pressing and mold-stripping are undertaken; thereby, disposable solid polymer microneedle arrays can be batch-fabricated.
Claims31
A method for fabricating a microneedle array, comprising the following steps:
- providing a high aspect ratio microneedle array as a master pattern;
- spin-coating a first plastic material over said master pattern to form an embossing mold;
- and
- filling a second plastic material into said embossing mold, and undertaking baking, pressing, mold-stripping and curing procedures of said second plastic material to obtain a polymer microneedle array.
A method for fabricating an embossing mold of a microneedle array, comprising the following steps:
- providing a high aspect ratio microneedle array as a master pattern;
- spin-coating a first plastic material over said master pattern to form a first polymer layer;
- removing gas bubbles inside said first polymer layer;
- and
- undertaking baking, pressing, mold-stripping and curing procedures of said first polymer layer to obtain an embossing mold of said microneedle array.
Dependencies are inferred from the claim text.