Mold structure, patterning method using the same, and method of fabricating liquid crystal display device
AssigneeLG Display Co., Ltd.
InventorJin Wuk Kim
Life of this patent
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Abstract
A mold structure, a patterning method thereof and a method of fabricating an LCD device using the same are disclosed, which can realize a conformal contact by applying a voltage between a mold structure and a material layer being opposite to each other in an In-Plane Printing process, so as to prevent defective patterns, wherein the mold structure comprises a mold whose surface is provided with patterns; a backplane for supporting the mold; and a conductive film formed between the backplane and the mold.
Claims18
A mold structure comprising:
- a mold having patterns;
- a backplane for supporting the mold;
- and
- a conductive film disposed between the backplane and the mold.
A patterning method comprising:
- preparing a mold structure including a mold having patterns, a backplane for supporting the mold, and a conductive film between the backplane and the mold;
- positioning a substrate coated with a material layer in opposite to the mold structure;
- generating an electric field between the mold structure and the material layer;
- forming a pattern in the material layer based on the patterns of the mold by using the electric field;
- and
- separating the mold structure from the patterned material layer.
A method of fabricating an LCD device comprising:
- preparing first and second substrates, each defined with red, green, blue and white sub-pixels arranged regularly;
- forming a light-shielding layer on the other portions except the sub-pixels of the first substrate;
- forming red, green and blue color filter layers in the respective red, green and blue sub-pixels of the first substrate;
- forming a material layer on the first substrate including the light-shielding layer and the red, green and blue color filter layers;
- forming a white color filter layer in the white sub-pixel, an overcoat layer for planarizing the surface of first substrate, and a column spacer for maintaining a gap between the first and second substrates by patterning the material layer using a mold structure, at the same time;
- forming a thin film transistor array on the second substrate;
- and
- forming a liquid crystal layer between the first and second substrates,
- wherein patterning the material layer by using the mold structure comprises:
- preparing the mold structure including a mold provided with patterns for forming the column spacer and the white sub-pixel, a backplane for supporting the mold, and a conductive film between the backplane and the mold;
- positioning the mold structure in opposite to the first substrate loaded onto a stage;
- generating an electric field between the mold structure and the first substrate;
- forming the white color filter layer, the overcoat layer, and the column spacer corresponding to the patterns of the mold structure in the material layer by using the electric field, at the same time;
- and
- separating the mold structure from the patterned material layer.
A method of fabricating an LCD device, including a first substrate provided with a color filter array, a second substrate provided with a thin film transistor array, and a liquid crystal layer formed between the first and second substrates, wherein forming the second substrate comprises:
- forming a thin film transistor on the second substrate;
- forming a material layer on the second substrate including the thin film transistor;
- and
- patterning the material layer by using a mold structure, so as to form a passivation film to cover the thin film transistor, a contact hole to expose an electrode of the thin film transistor, and a first column spacer to maintain a gap between the first and second substrates, at the same time,
- wherein patterning the material layer by using the mold structure comprises:
- preparing a mold structure including a mold provided with patterns for forming the contact hole, the first column spacer, and the passivation film, a backplane for supporting the mold, and a conductive film between the backplane and the mold;
- positioning the mold structure in opposite to the second substrate loaded onto a stage;
- generating an electric field between the mold structure and the second substrate;
- forming the contact hole, the passivation film and the first column spacer corresponding to the patterns of the mold structure in the material layer by using the electric field, at the same time;
- and
- separating the mold structure from the patterned material layer.
Dependencies are inferred from the claim text.