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US 2008/0157402 A1Published application
Dual molded multi-chip package system
AssigneeSTATS ChipPAC, Ltd.
InventorsKambhampati Ramakrishna, Il Kwon Shim, Seng Guan Chow
Life of this patent
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Abstract
A dual molded multi-chip package system is provided including forming an embedded integrated circuit package system having a first encapsulation partially covering a first integrated circuit die and a lead connected thereto, mounting a semiconductor device over the first encapsulation and connected to the lead, and forming a second encapsulation over the semiconductor device and the embedded integrated circuit package system.
Claims20
A dual molded multi-chip package system comprising:
- forming an embedded integrated circuit package system having a first encapsulation partially covering a first integrated circuit die and a lead connected thereto;
- mounting a semiconductor device over the first encapsulation and connected to the lead;
- and
- forming a second encapsulation over the semiconductor device and the embedded integrated circuit package system.
1 more element
A dual molded multi-chip package system comprising:
- forming an embedded integrated circuit package system having a first encapsulation partially covering a first integrated circuit die and a lead connected thereto with a first active side of the first integrated circuit die exposed;
- forming a solder mask over the first encapsulation;
- connecting an external interconnect and the embedded integrated circuit package system over the solder mask;
- mounting a semiconductor device over the first encapsulation and connected to the lead;
- and
- forming a second encapsulation over the semiconductor device and the embedded integrated circuit package system.
3 more elements
A dual molded multi-chip package system comprising:
- an embedded integrated circuit package system having a first encapsulation partially covering a first integrated circuit die and a lead;
- a semiconductor device over the first encapsulation;
- an internal interconnect between the lead and the semiconductor device;
- a trace between the lead and the first integrated circuit die;
- and
- a second encapsulation over the semiconductor device and the embedded integrated circuit package system.
3 more elements
Dependencies are inferred from the claim text.