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US 2008/0157401 A1Published application
Integrated circuit package with top pad
AssigneeSTATS ChipPAC, Ltd.
InventorOhSug Kim
Life of this patent
Estimating the term…
Abstract
An integrated circuit package system includes a bottom pad with a bottom tie bar, attaching an integrated circuit die over the bottom pad, attaching a top pad with a top tie bar, over the integrated circuit die, and applying an encapsulant wherein the top tie bar integral to the top pad, is exposed on a side of the encapsulant.
Claims20
An integrated circuit package system comprising:
- forming a bottom pad with a bottom tie bar;
- attaching an integrated circuit die over the bottom pad;
- attaching a top pad with a top tie bar, over the integrated circuit die;
- and
- applying an encapsulant wherein the top tie bar, integral to the top pad, is exposed on a side of the encapsulant.
2 more elements
An integrated circuit package system comprising:
- forming a bottom assembly having a bottom pad with a bottom tie bar;
- mounting an integrated circuit die over the bottom pad with the bottom tie bar;
- mounting a top pad having a top tie bar near the bottom tie bar and the top pad over the integrated circuit die;
- and
- forming an encapsulant wherein the top tie bar, integral to the top pad, and the bottom tie bar are exposed on a side of the encapsulant.
2 more elements
An integrated circuit package system comprising:
- a bottom pad with a bottom tie bar;
- an integrated circuit die over the bottom pad;
- a top pad with a top tie bar, over the integrated circuit die;
- and
- an encapsulant wherein the top tie bar, integral to the top pad, is exposed on a side of the encapsulant.
2 more elements
Dependencies are inferred from the claim text.