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US 2008/0157400 A1Published application
Semiconductor module
AssigneeCanon Kabushiki Kaisha
InventorsKoji Tsuduki, Takanori Suzuki
Life of this patent
Estimating the term…
Abstract
A semiconductor module includes a semiconductor chip sealed with an encapsulation resin prevented from overflowing from an inside of the outer edge by a wiring pattern extended portion extending from the wiring pattern along an outer edge of a solder resist pattern at an outside of the outer edge of the solder resist pattern.
Claims7
A semiconductor module comprising:
- a semiconductor chip;
- a substrate on which the semiconductor chip is mounted, and on which a wiring pattern connected to the semiconductor chip and a solder resist are formed;
- an encapsulation resin for sealing the semiconductor chip,
- wherein the solder resist is patterned to have an aperture in which an area in which the semiconductor chip is mounted, and a connecting portion between the semiconductor chip and the wiring pattern are arranged, and to have an outer edge surrounding an outer periphery of the area in which the semiconductor chip is mounted, and the connecting portion between the semiconductor chip and the wiring pattern, so as to suppress overflowing of the encapsulation resin from inside of the outer edge, and the wiring pattern crosses the solder resist, and wherein
- the semiconductor module further comprises a wiring pattern extended portion which extends from the wiring pattern along the outer edge of the solder resist at an outside of the outer edge of the solder resist, and which is filled with the encapsulation resin up to the outer edge of the solder resist and up to an outer edge of the wiring pattern extended portion.
2 more elements
A semiconductor module comprising:
- a semiconductor chip;
- a substrate on which the semiconductor chip is mounted, and on which a wiring pattern and connected to the semiconductor chip and a solder resist are formed;
- an encapsulation resin for sealing the semiconductor chip, wherein
- the solder resist is patterned to have an aperture in which an area in which the semiconductor chip is mounted, and a connecting portion between the semiconductor chip and the wiring pattern are arranged, and to have an outer edge surrounding an outer periphery of the area in which the semiconductor chip is mounted, and the connecting portion between the semiconductor chip and the wiring pattern, so as to suppress overflowing of the encapsulation resin from inside of the outer edge, and the wiring pattern crosses the solder resist, and wherein
- the semiconductor module further comprises a wiring pattern extended portion extending from the wiring pattern along the outer edge of the solder resist at an outside of the outer edge of the solder resist, and filled with the encapsulation resin up to the outer edge of the solder resist, and up to an outer edge of the wiring pattern extended portion.
2 more elements
Dependencies are inferred from the claim text.