Semiconductor device package having pseudo chips

A structure of semiconductor device package, comprising:

• a first substrate with first die receiving through holes;
• a first die having first bonding pads and a second die having second bonding pads disposed within said first die receiving through holes, respectively;
• a first adhesion material formed in the gap between said first and second die and sidewalls of said first die receiving though holes of said first substrate;
• redistribution lines formed to couple contact pads formed on said first substrate to said first bonding pads and said second bonding pads, respectively;
• a protection layer formed on said redistribution lines, said first die, said second die and said first substrate;
• a second substrate with second die receiving through holes and second contact pads, and formed on an second attached material and under said first substrate;
• and
• a third die having third bonding pads disposed within said second die receiving through holes.

A structure of semiconductor device package, comprising:

• a first substrate with die receiving through holes;
• a first die having first bonding pads and a second die having second bonding pads disposed within said die receiving through holes, respectively;
• a first adhesion material formed in the gap between said first and second die and sidewalls of said die receiving though holes of said first substrate;
• redistribution lines formed to couple first contact pads formed on said first substrate to said first bonding pads and said second bonding pads;
• a protection layer formed on said redistribution lines, said first die, said second die and said first substrate;
• a third die having third bonding pads disposed under said first substrate;
• and
• a second substrate with second contact pads and circuit wiring formed therein and formed under said third die.