Flip-chip packages and methods of manufacturing the same

Abstract

A flip-chip package may include: a semiconductor chip having first pads arranged substantially along a first direction; a substrate having second pads, arranged substantially in a zigzag form aligned with the first pads as a center line, and facing the semiconductor chip; and conductive bumps for electrically connecting the first pads to the second pads in a one-to-one relationship. Adjacent conductive bumps may extend in different directions. A method of manufacturing a flip-chip package may include: forming conductive bumps that extend along different directions on first pads of a semiconductor chip; and connecting second pads of a substrate to the conductive bumps in a one-to-one relationship. A method of manufacturing a flip-chip package may include: forming conductive bumps that extend along different directions on second pads of a substrate; and connecting first pads of a semiconductor chip to the conductive bumps in a one-to-one relationship.

Dependencies are inferred from the claim text.