Semiconductor packages, stacked semiconductor packages, and methods of manufacturing the semiconductor packages and the stacked semiconductor packages

A stacked semiconductor package, comprising:

• a first semiconductor package;
• and
• a second semiconductor package;
• wherein the first semiconductor package includes:
• a first semiconductor pattern;
• a first bonding pad;
• and
• a first polymer insulation member;
• wherein the first semiconductor pattern includes a first semiconductor device and a first hole,
• wherein the first bonding pad includes a first wiring pattern and a first plug,
• wherein the first wiring pattern is formed on an upper face of the first semiconductor pattern,
• wherein the first wiring pattern is electrically connected to the first semiconductor device,
• wherein the first plug extends from the first wiring pattern to at least substantially fill the first hole,
• wherein the first polymer insulation member is formed on a lower face of the first semiconductor pattern,
• wherein the first polymer insulation member includes a second hole, and
• wherein the second hole exposes a lower end of the first plug,
• wherein the second semiconductor package includes:
• a second semiconductor pattern;
• a second bonding pad;
• and
• a second polymer insulation member;
• wherein the second semiconductor pattern includes a second semiconductor device and a third hole,
• wherein the second bonding pad includes a second wiring pattern and a second plug,
• wherein the second wiring pattern is formed on an upper face of the second semiconductor pattern,
• wherein the second wiring pattern is electrically connected to the second semiconductor device,
• wherein the second plug extends from the second wiring pattern to at least substantially fill the third hole,
• wherein the second polymer insulation member is formed on a lower face of the second semiconductor pattern,
• wherein the second polymer insulation member includes a fourth hole, and
• wherein the fourth hole exposes a lower end of the second plug.

A method of manufacturing a semiconductor package, comprising:

• forming a first hole through a semiconductor substrate that includes a plurality of semiconductor devices;
• forming a bonding pad, that includes a wiring pattern formed on an upper face of that semiconductor substrate adapted to be electrically connected to each of the semiconductor devices, and a plug, extending from the wiring pattern to at least substantially fill the first hole,
• attaching a supporting member to the upper face of the semiconductor substrate using an adhesive member;
• reducing a thickness of the semiconductor substrate to expose a lower end of the plug from a lower face of the semiconductor substrate;
• forming a polymer insulation member, that includes a second hole for exposing the lower end of the plug, on the lower face of the semiconductor substrate at a temperature that allows or temperatures that allow the supporting member not to be thermally decomposed;
• and
• cutting the semiconductor substrate along a scribe lane.

A method of manufacturing a stacked semiconductor package, comprising:

• forming a first hole through a semiconductor substrate that includes a plurality of semiconductor devices;
• forming a bonding pad, that includes a wiring pattern formed on an upper face of the semiconductor substrate adapted to be electrically connected to each of the semiconductor devices, and a plug, extending from the wiring pattern to at least substantially fill the first hole;
• attaching a supporting member to the upper face of the semiconductor substrate using an adhesive member;
• reducing a thickness of the semiconductor substrate to expose a lower end of the plug from a lower face of the semiconductor substrate;
• forming a polymer insulation member, that includes a second hole for exposing the lower end of the plug, on the lower face of the semiconductor substrate at a temperature that allows or temperatures that allow the supporting member to be not thermally decomposed:
• cutting the semiconductor substrate along a scribe lane to form a plurality of semiconductor packages;
• removing the supporting member from the semiconductor packages;
• and
• stacking the semiconductor packages using the polymer insulation member between the stacked semiconductor packages to connect the wiring patterns of the semiconductor packages to the plugs of corresponding semiconductor packages.