Semiconductor device
AssigneeKabushiki Kaisha Toshiba
InventorsChikaaki KODAMA, Mikihiko Ito
Life of this patent
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Abstract
A semiconductor device comprises a package board, a first semiconductor chip which is rectangular in shape, has a plurality of first pads arranged along its short side and is placed on the package board, and a second semiconductor chip which is rectangular in shape, has a plurality of second pads arranged along its short side and is placed on the first semiconductor chip so that a vertex of the second semiconductor chip at which its long side and its short side along which no pads are arranged meet falls on a vertex of the first semiconductor chip at which its long side and its short side along which no pads are arranged, and the long sides of the first and second semiconductor chips intersect each other.
Claims20
A semiconductor device comprising:
- a package board;
- a first semiconductor chip which is rectangular in shape, has a plurality of first pads arranged along its short side and is placed on the package board;
- and
- a second semiconductor chip which is rectangular in shape, has a plurality of second pads arranged along its short side and is placed on the first semiconductor chip so that a vertex of the second semiconductor chip at which its long side and its short side along which no pads are arranged meet falls on a vertex of the first semiconductor chip at which its long side and its short side along which no pads are arranged, and the long sides of the first and second semiconductor chips intersect each other.
A semiconductor device comprising:
- a package board;
- a first semiconductor chip which is rectangular in shape, has first and second sets of pads each of which is arranged along a respective one of its two short sides, and is placed on the package board;
- and
- a second semiconductor chip which is rectangular in shape, has third and fourth sets of pads each of which is arranged along a respective one of its short side, and is placed on the first semiconductor chip so that the second semiconductor chip is located between the first and second sets of pads of the first semiconductor chip, and the long sides of the first and second semiconductor chips intersect each other.
A semiconductor device comprising:
- a package board;
- a first semiconductor chip which is rectangular in shape, has a first set of pads arranged along its long side and placed on the package board;
- a second semiconductor chip which is rectangular in shape, has a second set of pads arranged along its long side and placed on the package board so that respective long sides of the first and the second semiconductor chips along which no pads are arranged come into contact with each other;
- a third semiconductor chip which is rectangular in shape, has a third set of pads arranged along its long side and is placed on the first and second semiconductor chips so that a short side of the third semiconductor chip intersect the short sides of the first and second semiconductor chips;
- and
- a fourth semiconductor chip which is rectangular in shape, has a fourth set of pads arranged along its long side and is placed on the first and second semiconductor chips so that respective long sides of the third and the forth semiconductor chips along which no pads are arranged come into contact with each other, and a short side of the forth semiconductor chip intersect the short sides of the first and second semiconductor chips.
Dependencies are inferred from the claim text.