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US 2008/0157392 A1Published application
Methods of forming stepped bumps and structures formed thereby
OwnerAndrew Yeohi, Guotao Wang +2inventors
InventorsAndrew Yeohi, Guotao Wang, Sairam Agraharam, Sudarshan Rangaraj
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Abstract
Methods of forming a microelectronic device and associated structures are described. Those methods may comprise forming a die-side conductive interconnect on a substrate, wherein the die-side conductive interconnect comprises a columnar portion and a base portion, and wherein a diameter of the base portion is greater than a diameter of the columnar portion.
Claims12
A structure comprising:
- a die-side conductive interconnect disposed on a substrate, wherein the die-side conductive interconnect comprises a columnar portion and a base portion, and wherein a diameter of the base portion is greater than a diameter of the columnar portion;
- and
- a solder bump disposed on a package substrate, wherein the solder bump is coupled with the columnar portion of the conductive interconnect.
Dependencies are inferred from the claim text.