Semiconductor package and module printed circuit board for mounting the same

A module printed circuit board (PCB) comprising:

• a circuit substrate;
• a mount region for mounting a semiconductor package disposed on the circuit substrate;
• a first-type pad structure disposed in a first region of the mount region;
• and
• a second-type pad structure disposed in a second region of the mount region,
• wherein the first-type pad structure includes:
• a first conductive pad disposed on the circuit substrate;
• and
• a first insulating layer coated on the circuit substrate to have a first opening by
• which a portion of a sidewall of the first conductive pad is exposed and partially covers the first conductive pad,
• and wherein the second-type pad structure includes:
• a second insulating layer coated on the circuit substrate to have a second opening;
• and
• a second conductive pad disposed on the circuit substrate in the second opening to have an exposed sidewall.

A module printed circuit board (PCB) comprising:

• a circuit substrate;
• a plurality of mount regions for mounting semiconductor packages disposed on the circuit substrate;
• a third-type pad structure disposed in a first region of an outermost mount region;
• and
• a second-type pad structure disposed in a second region of the outermost mount region,
• wherein the third-type pad structure includes a third conductive pad disposed on the circuit substrate and a third insulating layer coated on the circuit substrate to overlap an edge of the third conductive pad,
• and the second-type pad structure includes a second insulating layer coated on the circuit substrate to have a second opening and a second conductive pad disposed on the circuit substrate in the second opening to have an exposed sidewall.