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US 2008/0157382 A1Published application
Direct termination of a wiring metal in a semiconductor device
OwnerAnil K. Chinthakindi, Douglas D. Coolbaugh +4inventors
InventorsAnil K. Chinthakindi, Douglas D. Coolbaugh, Timothy J. Dalton, Ebenezer E. Eshun, Anthony K. Stamper, Richard P. Volant
Life of this patent
Estimating the term…
Abstract
Direct termination of a wiring metal in a semiconductor device. Direct termination of an AlCu stack or an AlCu layer is made with an underlying Cu wiring level. The AlCu stack or AlCu layer covers all of the Cu wiring level such that it has a border that extends beyond all of the wiring to prevent exposure from occurring.
Claims10
A semiconductor device, comprising:
- a semiconductor base;
- a dielectric layer on the semiconductor base;
- at least one copper wiring level in the dielectric layer;
- an aluminum stack wiring level in direct contact with the at least one copper wiring level, wherein the aluminum stack wiring level covers all of the at least one copper wiring level.
1 more element
A semiconductor device, comprising:
- a semiconductor base;
- a dielectric layer on the semiconductor base;
- at least one copper wiring level in the dielectric layer;
- a barrier layer in direct contact with the at least one copper wiring level;
- and
- an aluminum wiring level in direct contact with the barrier layer and the at least one copper wiring level, wherein the aluminum wiring level covers all of the barrier layer and the at least one copper wiring level.
3 more elements
A semiconductor device, comprising:
- a semiconductor base;
- a dielectric layer on the semiconductor base;
- at least one copper wiring level in the dielectric layer, wherein a portion of the at least one copper wiring level protrudes above the dielectric layer;
- an aluminum stack wiring level in direct contact with the at least one copper wiring level, wherein the aluminum stack wiring level covers all of the at least one copper wiring level, wherein the aluminum stack wiring level has a border that extends beyond all of the at least one copper wiring level to prevent exposure from occurring.
1 more element
Dependencies are inferred from the claim text.