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US 2008/0157374 A1Published application
Semiconductor device and fabricating method thereof
OwnerJae-Won Haninventor
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Abstract
A semiconductor device including an integrated device having a first device having a first pad part formed on a top metal layer, a second device arranged at the circumference of the first device and having a second pad part formed on the top metal layer, a connecting electrode electrically connecting the first pad part to the second pad part; and a bonding pad part connected the integrated device and connecting signals to the external.
Claims20
An apparatus comprising:
- an integrated device including a first semiconductor device having a first pad formed over a metal layer, a second semiconductor device arranged at the outer periphery of the first semiconductor device and having a second pad formed over the metal layer, and a connecting electrode electrically connecting the first pad to the second pad;
- and
- a bonding pad connected to the integrated device.
A method comprising:
- forming a first device having a first pad formed over a metal layer and a second device having a second pad formed over the metal layer;
- arranging the second device at the outer periphery of the first device;
- providing an integrated device by forming a connecting electrode electrically connecting the first pad to the second pad;
- electrically connecting a bonding pad to the integrated device;
- forming a protective layer over the integrated device;
- and then
- exposing at least a portion of the uppermost surface of the bonding pad by etching the protective layer.
4 more elements
A method comprising:
- forming a plurality of semiconductor devices;
- providing an integrated device by electrically connecting the plurality of semiconductor devices;
- electrically connecting a bonding pad to the integrated device;
- forming a protective layer over the integrated device;
- and then
- exposing at least a portion of the uppermost surface of the bonding pad.
- forming a second semiconductor device having a second pad over the second semiconductor substrate;
- forming a connecting electrode having a multilayer structure to electrically connect the first semiconductor device to the second semiconductor device;
- forming a bonding pad over the metal layer.
6 more elements
Dependencies are inferred from the claim text.