Conductive systems and devices including wires coupled to anisotropic conductive film, and methods of forming the same

A device comprising:

• a substrate comprising at least one integrated circuit having a conductive terminal at an active surface of the substrate;
• an anisotropic conductive film on the active surface;
• and
• a wire extending between and coupled to the conductive terminal and the anisotropic conductive film.

A method of anchoring a wire to a surface of a die, comprising:

• attaching an anisotropic conductive film to the surface of the die;
• attaching a bump to the anisotropic conductive film;
• and
• attaching the wire to the bump.

A method of forming a device, comprising:

• forming at least one integrated circuit on a substrate;
• attaching an anisotropic conductive film to the surface of the substrate;
• forming a conductive bump on a surface of the anisotropic conductive film;
• attaching a wire to a conductive terminal of the integrated circuit at the surface of the substrate and the anisotropic conductive film;
• and
• attaching the wire to the conductive bump on the surface of the anisotropic conductive film.