Wafer level package with die receiving through-hole and method of the same
AssigneeAdvanced Chip Engineering Technology Inc.
InventorWen-Kun Yang
Life of this patent
Estimating the term…
Abstract
The present invention discloses a structure of package comprising: a substrate with a die receiving through holes, a conductive connecting through holes structure and coupled a first contact pad on the upper surface of the substrate and a second contact pads on lower surface of the substrate; at least a die with metal pads disposed within the die receiving through holes; a surrounding material formed under the die and filled in the gap between the sidewall of die and sidewall of the die receiving though holes; a re-distribution layer (RDL) formed on the die, substrate and surrounding material; and coupled the metal pads of the die to the first contact pad; an isolating base having adhesion material formed over the RDL.
Claims22
A structure of semiconductor device package comprising:
- a substrate with die receiving through holes, a conductive connecting through holes structure, wherein said conductive connecting through holes coupled a first contact pads on upper surface of said substrate and a second contact pads on lower surface of said substrate;
- at least a die with metal pads disposed within said die receiving through holes;
- a surrounding material formed under said die and filled in the gap between the sidewall of said die and sidewall of said die receiving though holes;
- a re-distribution layers (RDL) formed on said die, said substrate and coupled said metal pads of said die to said first contact pad.
A method for forming semiconductor device package comprising:
- providing a substrate with die receiving through holes, a conductive connecting through holes structure, wherein said conductive connecting through holes coupled a first contact metal pads on upper surface of said substrate and a second contact pads on lower surface of said substrates;
- printing patterned glues on a die redistribution tool having alignment pattern on top surface;
- bonding said substrate on said patterned glues of said die redistribution tool by a fine alignment system;
- redistributing at least a desired dice having metal pads on said die redistribution tool with desired pitch into said die receiving through holes by a pick and place fine alignment system and stick said die by patterned glues;
- refilling core paste material into the space between the sidewall of said dice and sidewall of said die receiving through hole and back side of said dice;
- bonding carrier on the back side of panel;
- separating the panel from said die redistribution tool by releasing patterned glues;
- cleaning the metal pads of said dice;
- forming at least one conductive built up layer (RDL) over said dice, said core paste material and said substrate and couple to said first contact pads of said substrate;
- forming an isolating base having adhesion material over said at least one conductive built up layer (RDL);
- de-bonding the carrier from the back side of said panel;
- and
- singulating the panel package becomes individual package.
Dependencies are inferred from the claim text.