Semiconductor device having multiple die redistribution layer
AssigneeSanDisk Corporation
InventorsHem Takiar, Shrikar Bhagath
Life of this patent
Estimating the term…
Abstract
A semiconductor device and methods of forming same are disclosed having multiple die redistribution layer. After fabrication of semiconductor die on a wafer and prior to singulation from the wafer, adjacent semiconductor die are paired together and a redistribution layer may be formed across the die pair. The redistribution layer may be used to redistribute at least a portion of the bond pads from the first die in the pair to a second die in the pair. One die in each pair will be a working die and the other die in each pair will be a dummy die. The function of the integrated circuit beneath the redistribution layer on the dummy die is at least partially sacrificed.
Claims27
A semiconductor device, comprising:
- a first semiconductor die having internal circuitry, a first set of inner bond pads electrically connected to the internal circuitry of the first semiconductor die, and a first edge;
- a second semiconductor die having internal circuitry, a second set of inner bond pads electrically connected to the internal circuitry of the second semiconductor die, and a second edge adjacent the first edge of the first semiconductor die;
- and
- a redistribution layer formed on surfaces of the first and second semiconductor die and including:
- a set of outer bond pads on at least the second semiconductor die for electrically connecting the first semiconductor die with an external device,
- an electrical connection between one of the inner bond pads of the first set of inner bond pads on the first semiconductor die and an outer bond pad of the set of outer bond pads on the second semiconductor die, and
- at least a majority of inner bond pads of the second set of inner bond pads on the second semiconductor having no electrical connection to an external device.
A semiconductor device, comprising:
- first and second semiconductor die formed contiguously on a wafer and singulated as an integral component, the first semiconductor die including one or more inner bond pads;
- and
- a redistribution layer provided on the first and second semiconductor die and including one or more outer bond pads on the second semiconductor die, the redistribution layer electrically connecting the one or more inner bond pads on the first semiconductor die to the one or more outer bond pads on the second semiconductor die.
A semiconductor wafer, comprising:
- a plurality of semiconductor die, first and second contiguous semiconductor die of the plurality of semiconductor die each including circuitry capable of performing an identical function and each including inner bond pads;
- a redistribution layer provided on the first and second semiconductor die and including one or more outer bond pads on the second semiconductor die, the redistribution layer electrically connecting one or more inner bond pads on the first semiconductor die to the one or more outer bond pads on the second semiconductor die.
Dependencies are inferred from the claim text.