Control of Standoff Height Between Packages with a Solder-Embedded Tape
AssigneeTexas Instruments Incorporated
InventorsMasako Watanabe, Masazumi Amagai
Life of this patent
Estimating the term…
Abstract
A microelectronic device package interconnect for electrically connecting a plurality of substrates is provided. The microelectronic device package interconnect comprises an insulative layer positioned on a substrate, wherein the insulative layer has an opening extending through the insulative layer to the substrate. The microelectronic device package interconnect further comprises solder positioned in the opening.
Claims22
A microelectronic device package interconnect for electrically connecting a plurality of substrates, comprising:
- an insulative layer positioned on a substrate, the insulative layer having an opening extending through the insulative layer to the substrate;
- and
- solder positioned in the opening.
A method for manufacturing a microelectronic device package interconnect, comprising:
- laminating an insulative layer onto a substrate, the insulative layer having a plurality of openings extending through the insulative layer;
- and
- placing solder into the openings of the insulative layer.
A printed circuit board (PCB) comprising:
- a substrate having a plurality of electrical contact sites;
- a microelectronic device package disposed over the electrical contact sites;
- an insulative layer positioned between the substrate and the package, the insulative layer having an opening;
- and
- a solder positioned in the opening and electrically coupling the substrate to the microelectronic device package.
Dependencies are inferred from the claim text.