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US 2008/0157350 A1Published application
Package on package design to improve functionality and efficiency
AssigneeIntel Corporation
InventorsBok Eng Cheah, Shanggar Periaman, Kooi Chi Ooi
Life of this patent
Estimating the term…
Abstract
Methods and apparatus to provide an improved package on package (PoP) design are described. In one embodiment, a central processing unit (CPU) package substrate and an embedded package (which may include one or more heat removal channels) are molded. Other embodiments are also described.
Claims15
An apparatus comprising:
- a central processing unit (CPU) package substrate;
- a semiconductor package comprising a chipset die and a memory die to form an embedded package, wherein the embedded package is coupled to the CPU package substrate on a first side of the embedded package, the embedded package to comprise one or more heat removal channels;
- and
- a mold material to mechanically couple the CPU package substrate to the embedded package and at least partially encapsulate the CPU package substrate and the embedded package.
1 more element
A method comprising:
- electrically coupling one or more vias of a first package and a second package, wherein the first package and second package are coupled to form an embedded package;
- forming heat removal channels in the embedded package;
- molding the embedded package;
- and
- mounting a central processing unit (CPU) package to the molded embedded package.
2 more elements
Dependencies are inferred from the claim text.