Method for fabricating heat-dissipating package and heat-dissipating structure applicable thereto

A method for fabricating a heat-dissipating package, comprising the steps of:

• mounting and electrically connecting a semiconductor chip to a chip carrier;
• mounting a heat-dissipating structure to the semiconductor chip, wherein the heat-dissipating structure comprises a main body having a first surface that has a covering layer formed thereon, a second surface opposite to the first surface, and a plurality of protruding portions upwardly protruded from and formed at edges of the main body, and wherein a size of the heat-dissipating structure is larger than a predetermined size of the package, such that the edges of the main body of the heat-dissipating structure extend beyond corresponding sides of the semiconductor chip, after the heat-dissipating structure is attached to the semiconductor chip via the second surface of the main body thereof;
• performing a molding process to form an encapsulant covering the heat-dissipating structure and the semiconductor chip, wherein the molding process includes disposing the chip carrier mounted with the semiconductor chip and the heat-dissipating structure into a mold cavity of a mold, filling the mold cavity with at least one packaging material, and removing the mold;
• performing a singulation process to form the package with the predetermined size;
• and
• performing a removing process to remove a portion of the encapsulant formed on the covering layer.