Curved heat spreader design for electronic assemblies
OwnerDaoqiang LU, Wei SHIinventors
Life of this patent
Estimating the term…
Abstract
The formation of electronic assemblies is described. One embodiment relates to an electronic assembly including a die coupled to a substrate, the die including a curved surface. The assembly also includes a thermal interface material having a first curved surface and a second curved surface, the first curved surface coupled to the curved surface of the die. The assembly also includes a heat spreader having a curved surface, wherein the curved surface of the heat spreader is coupled to the second curved surface of the thermal interface material. Other embodiments are described and claimed.
Claims19
An electronic assembly comprising:
- a heat spreader;
- a die;
- a thermal interface material positioned between the thermally conductive heat spreader and the die;
- the die having a first die surface facing the thermal interface material, the first die surface including a convex curvature;
- the heat spreader having a first heat spreader surface facing the thermal interface material, the first heat spreader surface including a concave curvature;
- and
- the thermal interface material including a convex surface coupled to the first heat spreader surface, and the thermal interface material including a concave surface coupled to the first die surface.
An electronic assembly comprising;
- a die coupled to a substrate, the die including a curved surface;
- a thermal interface material having a first curved surface and a second curved surface, the first curved surface coupled to the curved surface of the die;
- and
- a heat spreader including a curved surface;
- wherein the curved surface of the heat spreader is coupled to the second curved surface of the thermal interface material.
A method for forming an electronic assembly, comprising:
- positioning a thermal interface material on a curved surface of a die;
- positioning a heat spreader having a curved surface on the thermal interface material, to form a stack including the die, the thermal interface material, and the heat spreader, wherein the curved surface of the heat spreader is positioned to face the thermal interface material, and wherein the thermal interface material is positioned between the curved surface of the die and the curved surface of the heat spreader;
- and
- applying a force to the stack and heating the thermal interface material to a suitable temperature to couple the heat spreader to the die through the thermal interface material.
Dependencies are inferred from the claim text.