RF module package
AssigneeAdvanced Chip Engineering Technology Inc.
InventorsWen-Kun Yang, Chun-Hui Yu, Chihwei Lin
Life of this patent
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Abstract
The present invention discloses a structure of package comprising: a substrate with a die receiving through hole; a base attached on a lower surface of the substrate; a die disposed within the die receiving through hole and attached on the base; a dielectric layer formed on the die and the substrate; a re-distribution layer (RDL) formed on the dielectric layer and coupled to the die; a protection layer formed over the RDL; and pluralities of pads formed on the protection layer and coupled to the RDL. The RDL is made from an alloy comprising Ti/Cu/Au alloy or Ti/Cu/Ni/Au alloy.
Claims24
A RF module package structure comprising:
- a substrate with a die receiving through hole and contact conductive pads and metal through holes;
- a conductive slice attached on a lower surface of said substrate;
- multiple dice disposed within said die receiving through hole and on said conductive slice;
- multiple dielectric stacking structure stacked on said multiple dice and said substrate;
- multiple re-distribution layers (RDL) formed within said multiple dielectric stacking structure and coupled to said dice;
- a top conductive layer formed over said multiple dielectric stacking structure.
A method for forming RF module package comprising:
- providing a substrate with die receiving through holes and contact metal pads and metal through holes;
- preparing a die redistribution tool (Glass base) with patterned glues and alignment pattern on said die redistribution tool, followed by employing a pick and place with fine alignment system to pick and place the selected dice on said die redistribution tool and said patterned glues sticking active surfaces of said dice;
- bonding said substrate on said die redistribution tool and said patterned glues sticking said substrate;
- printing core material into the gap between the dice edge and side wall of said dice through holes;
- releasing said die redistribution tool;
- sputtering seed metal on the back side of said substrate;
- forming a ground metal pads and terminal pads;
- forming multiple dielectric stacking structure with multiple RDLs;
- forming a ground pad on top of said multiple dielectric stacking structure;
Dependencies are inferred from the claim text.