RF module package

A method for forming RF module package comprising:

• providing a substrate with die receiving through holes, conductive connecting through holes and contact metal pads on both side;
• preparing a die redistribution tool with patterned glues and alignment pattern on said die redistribution tool, followed by employing a pick and place with fine alignment system to pick and place the selected dice on said die redistribution tool and said patterned glues sticking active surfaces of said dice;
• bonding said substrate on said die redistribution tool and said patterned glues sticking said substrate;
• printing core paste material into the gap between the dice edge and side wall of said die receiving through holes and portion of the backside of said dice;
• separating said substrate with embedded multiple dice from said die redistribution tool by releasing said patterned glues;
• sputtering seed metal layers on the backside of said substrate and the backside of said multiple dice;
• forming a contacting structure (ground metal pads and terminal pads) on the backside (lower surface) of said substrate and the backside of said multiple dice;
• forming multiple dielectric stacking structure with multiple RDLs on the upper surface of said substrate and said multiple dice;
• and
• forming a top layers on top of said multiple dielectric stacking structure.

A structure of Inter-connecting of semiconductor device package comprising:

• a substrate with at least die receiving through holes;
• at least a die disposed within said die receiving through holes;
• an adhesion material filled into the gap between the edge of said die and the sidewall of said die receiving through holes;
• and
• a conductive slice attached on the backside of said die and covering said adhesion material and a portion of the backside of said substrate, wherein said conductive slice includes seed metal Ti/Cu or Cu layers and plating metal layers Cu/Ni/Au.