Packing board for electronic device, packing board manufacturing method, semiconductor module, semiconductor module manufacturing method, and mobile device

A method of manufacturing a semiconductor module comprising:

• preparing a substrate having an electrode on its surface;
• forming a first conductor part on one surface of an insulating layer;
• embedding the first conductor in the insulating layer by pressure-bonding the insulating layer to the substrate while maintaining contact between the electrode and the first conductor part;
• and
• forming an aperture so as to expose the first conductor part through the other surface of the insulating layer;
• and forming a second conductor part in the aperture.

A packaging board comprising:

• a first wiring layer;
• an insulating layer provided on the first wiring layer and containing a fibrous filler inside;
• a second wiring layer provided on the insulating layer;
• and
• a via conductor penetrating the insulating layer and electrically connecting the first wiring layer and the second wiring layer, wherein
• the via conductor is provided with a first conductor part provided to be in contact with the first wiring layer and a second conductor part provided on the first conductor part, and the fibrous filler is located on the surface of the first conductor part on which the second conductor is provided.

A method of manufacturing a packaging board comprising:

• preparing a substrate having a first wiring layer on its surface;
• forming a first conductor part on one surface of an insulating layer containing a fibrous filler inside;
• embedding the first conductor part in the insulating layer by pressure-bonding the insulating layer to the substrate while maintaining contact between the first wiring layer and the first conductor part;
• pressing the first conductor part to the fibrous filler;
• forming an aperture so as to expose the first conductor part through the other surface of the insulating layer;
• and
• forming a second conductor part in the aperture and forming a second wiring layer connected to the second conductor part.